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Banks Eye $21 Billion of Bonds for Broadcom Chip-Financing Deal
(Bloomberg) — Banks are planning to sell as much as about $21 billion of high-grade bonds as soon as early next year as part of a $63 billion funding package that Broadcom Inc. has pulled together to help finance chips for AI developer Anthropic PBC.
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Bank of America Corp., Citigroup Inc., and Morgan Stanley helped to arrange the $63 billion deal and other banks are expected to submit commitments to join the group in the coming days, according to people with knowledge of the matter. The banks are lending about $42 billion of the amount, as much as half of which is expected to be refinanced in the US high-grade corporate bond market in the first quarter of 2027, they said, asking not to be identified because they're not authorized to speak publicly.
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